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Application of the technology of thin films and nanostructured materials in the manufacture of thermally loaded printed circuit boards

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Author(s): Sakhno E. A. | Balashov M. A. | Zhilikov V. V. | Lobasov D. V.

Journal: Tekhnologiya i Konstruirovanie v Elektronnoi Apparature
ISSN 2225-5818

Issue: 5;
Start page: 3;
Date: 2011;
Original page

Keywords: printed circuit board | metal base | thermal conductivity | aluminum nitride

ABSTRACT
The expediency is shown for application of aluminum nitride thin films, which has unique physical and chemical properties, for high heat resistance of the circuit board. There was described the technology of printed circuit board with resistors, located in the vias, based on the use of a metal base coated with aluminum nitride.
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