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Effect of Pulse Reverse Plating Using Silver On Printed Circuit Boards

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Author(s): S. Jayapoorani | Dalim Kumar Ghosh

Journal: International Journal of Computer Applications
ISSN 0975-8887

Volume: icwet;
Issue: 10;
Date: 2012;
Original page

Keywords: Pulse reverse plating | PCB | silver | Nanostructured coating | current density

ABSTRACT
Plating process is one of the most critical steps in the manufacturing process of PCB. The thickness distribution in the hole is an important factor in double sided and also multilayered PCB . Here the plating process is carried using pulse reverse plating on the printed circuit board . Pulse Reverse Electroplating is similar to DC plating but it has a square wave along with a periodic reverse current.[1]In periodic reverse current process a layer is produced on the cathode surface with a lower metal Concentration. Periodic reverse current help to obtain a plating thickness which is uniform in nature and also in nano structured grain size which results in high binding of the metal with the substrate

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