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he equipment for ohmic contacts formation in semi-conductor devices based on А3В5 connections

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Author(s): Aleksandrov S. B. | Krupalnik K. M. | Kornilov N. O. | Kondratyeva T. O.

Journal: Tekhnologiya i Konstruirovanie v Elektronnoi Apparature
ISSN 2225-5818

Issue: 1-2;
Start page: 49;
Date: 2011;
Original page

Keywords: semiconductor devices | ohmic contacts | electron-beam evaporation

ABSTRACT
Technological process features of ohmic contacts formation in semi-conductor devices based on А3В5 connections and the general principles of technological modules construction are considered. The results received by means of installations of an electron-beam evaporation of STE EB series and installations of fast thermal annealing of STE RTA series are shown.
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