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Helium Leak Measurements as a Predictor of Hermetic Package Life in Surgically-implanted Microelectronic Devices

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Author(s): P. E. K. Donaldson

Journal: Active and Passive Electronic Components
ISSN 0882-7516

Volume: 6;
Issue: 3-4;
Start page: 263;
Date: 1980;
Original page
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