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Highly Productive Process Technologies of Cantilever type Microprobe Arrays for Wafer Level Chip Testing

Author(s): Woo-Chang Choi | Jae-Hwan Lim | Jee-Youl Ryu

Journal: Transactions on Electrical and Electronic Materials
ISSN 1229-7607

Volume: 14;
Issue: 2;
Start page: 63;
Date: 2013;
Original page

Keywords: Microprobes | Cantilever-type | MEMS | Highly productive process | Au-Sn bonding

This paper describes the highly productive process technologies of microprobe arrays, which were used for a probecard to test a Dynamic Random Access Memory (DRAM) chip with fine pitch pads. Cantilever-type microprobearrays were fabricated using conventional micro-electro-mechanical system (MEMS) process technologies. Bondingmaterial, gold-tin (Au-Sn) paste, was used to bond the Ni-Co alloy microprobes to the ceramic space transformer.The electrical and mechanical characteristics of a probe card with fabricated microprobes were measured by aconventional probe card tester. A probe card assembled with the fabricated microprobes showed good x-y alignmentand planarity errors within ±5 μm and ±10 μm, respectively. In addition, the average leakage current and contactresistance were approximately 1.04 nA and 0.054 ohm, respectively. The proposed highly productive microprobes canbe applied to a MEMS probe card, to test a DRAM chip with fine pitch pads.

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