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Influence of the doping additives on heat stability and heat transfer of nickel coverings of cases IC

Author(s): Novosyadly S. P. | Ivanyuk P. M.

Journal: Tekhnologiya i Konstruirovanie v Elektronnoi Apparature
ISSN 2225-5818

Issue: 2;
Start page: 56;
Date: 2008;
Original page

Keywords: galvanic alloy | heat-resistance | body | microhardness | coating

With the help of modern diagnostic microanalysis tools, the regularities are established for variation of electrophysical parameters of Ni-B galvanic coating of IC packages in the process of ultrasonic welding of internal Al leads and package seal. The optimal composition of the electrolyte which provides heat resistance increase of IC packages with alloyed Ni coating is selected. This, combined with the local gilding, enables mounting of crystals through a eutectic Si-Au sublayer.
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