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Measurement of stress as a function of temperature in Ag and Cu thin films

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Author(s): Adam PROSZYNSKI | Dariusz CHOCYK | Grzegorz GLADYSZEWSKI | Tomasz PIENKOS | Longin GLADYSZEWSKI

Journal: Optica Applicata
ISSN 0078-5466

Volume: 35;
Issue: 3;
Start page: 517;
Date: 2005;
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Keywords: annealing | stress measurements | thin films

ABSTRACT
Stress measurements of 23 nm copper films and 93 nm silver films on Si (100) have been performed during thermal cycling between RT and 450°C. The changes in stress versus temperature are interpreted. The effects of treatment on microstructure and composition are studied by X-ray diffraction.
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Tango Jona
Tangokurs Rapperswil-Jona