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Modeling the Substrate Skin Effects in Mutual RL Characteristics.,

Author(s): H. Ymeri | B. Nauwelaers | K. Maex | D. de Roest

Journal: Radioengineering
ISSN 1210-2512

Volume: 12;
Issue: 4;
Start page: 21;
Date: 2003;
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The goal of this work was to model the influence of the substrateskin effects on the distributed mutual impedance per unit lengthparameters of multiple coupled on-chip interconnects. The proposedanalytic model is based on the frequency-dependent distribution of thecurrent in the silicon substrate and the closed form integrationapproach. It is shown that the calculated frequency-dependentdistributed mutual inductance and the associated mutual resistance arein good agreement with the results obtained from CAD-oriented circuitmodeling technique.
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