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WETTING OF COPPER BY LEAD-FREE Sn-Cu SOLDERS AND SHEAR STRENGTH OF Cu – Cu JOINTS

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Author(s): Pavol Šebo | Peter Švec | Dušan Janičkovič | Pavol Štefánik

Journal: Materials Engineering
ISSN 1335-0803

Volume: 16;
Issue: 2;
Start page: 22;
Date: 2009;
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Keywords: Lead-free solder | Wetting | Shear strength | Copper joints

ABSTRACT
Developing and microstructure of lead-free Sn-Cu solders containing 3, 5 and 10 wt. % of copper in bulk as well as in ribbon form is presented. Wetting of copper substrate by these solders at the temperatures 300, 350 and 400°C in air (partially in N2+10H2) during 1800 s was studied by sessile drop method. Joints Cu – solder – Cu were prepared at 300°C and 1800 s in air as well as in gas mix and their shear strength was measured. The microstructure was studied by light and scanning electron microscopy (SEM) equipped with energy dispersive X-ray analyzer and standard X-ray diffraction machine. Wetting angle decreases with increasing wetting temperature. Wetting angle increased for higher (10 wt. %) amount of copper in solder. Shear strength of the joints decreases with increasing the copper concentration in solder.
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