Academic Journals Database
Disseminating quality controlled scientific knowledge

Comparison of methods for broadband electromagnetic characterization of Molded Interconnect Device materials

ADD TO MY LIST
 
Author(s): C. Orlob | D. Kornek | S. Preihs | I. Rolfes

Journal: Advances in Radio Science - Kleinheubacher Berichte
ISSN 1684-9965

Volume: 7;
Start page: 11;
Date: 2009;
VIEW PDF   PDF DOWNLOAD PDF   Download PDF Original page

ABSTRACT
Combining the Molded Interconnect Device technology with the Laser Direct Structuring technology exhibits the potential of designing electrical and mechanical components on three-dimensional surfaces to increase functionality, level of integration and to reduce costs. When taking advantage of this technology especially in the design of RF devices, a precise knowledge of the electromagnetic parameters of the MID material is required, as the complex permeability and permittivity strongly influence the device performance. At present time, these materials are not electromagnetically characterized in the RF frequency range. In this paper different methods are therefore presented and compared with respect to their potentials for broadband electromagnetic characterization of Molded Interconnect Device materials.
RPA Switzerland

RPA Switzerland

Robotic process automation

    

Tango Rapperswil
Tango Rapperswil