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Coupling between Vias and the PCB Power-Bus

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Author(s): G. Heinrich | S. Dickmann

Journal: Advances in Radio Science - Kleinheubacher Berichte
ISSN 1684-9965

Volume: 7;
Start page: 261;
Date: 2009;
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ABSTRACT
In this paper, a method for the extraction of data for a through-hole vertical interconnect access (via) on a printed circuit board (PCB) is presented. It uses a matrix de-embedding algorithm and two-port theory to extract the elements of an assumed lumped via model. After that the influence of the via on the power-bus impedance and the coupling between the via and the power-bus are described using this model.

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