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Internet-based hardware/software co-design framework for embedded 3D graphics applications

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Author(s): Yeh Chi-Tsai | Wang Chun-Hao | Huang Ing-Jer | Wong Weng-Fai

Journal: EURASIP Journal on Advances in Signal Processing
ISSN 1687-6172

Volume: 2011;
Issue: 1;
Start page: 25;
Date: 2011;
Original page

Keywords: Hardware/software co-design | SystemC | Electronic system level | Internet | 3D graphics SoC | Heterogeneous hardware interface | Virtual machine

ABSTRACT
Abstract Advances in technology are making it possible to run three-dimensional (3D) graphics applications on embedded and handheld devices. In this article, we propose a hardware/software co-design environment for 3D graphics application development that includes the 3D graphics software, OpenGL ES application programming interface (API), device driver, and 3D graphics hardware simulators. We developed a 3D graphics system-on-a-chip (SoC) accelerator using transaction-level modeling (TLM). This gives software designers early access to the hardware even before it is ready. On the other hand, hardware designers also stand to gain from the more complex test benches made available in the software for verification. A unique aspect of our framework is that it allows hardware and software designers from geographically dispersed areas to cooperate and work on the same framework. Designs can be entered and executed from anywhere in the world without full access to the entire framework, which may include proprietary components. This results in controlled and secure transparency and reproducibility, granting leveled access to users of various roles.
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