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Key Technique of Glass Microfluidic Chips Etching Production Process on Slide

Author(s): Qichang Li

Journal: Scientific Journal of Frontier Chemical Development
ISSN 2167-163X

Volume: 3;
Issue: 3;
Start page: 54;
Date: 2013;
Original page

Keywords: Microfabrication process | microfluidic chips | AZ 4620 | UV thick photoresist lithography | wet etching

Concerning the higher cost and complex process, etc. in the production of microfluidic chips, the ordinary slide, a kind of soda-lime glass as substrate carrier and positive photoresist AZ 4620 as sacrificial layer, be the alternative, characterized by economic effectiveness, simplicity and short manufacture cycle. In this paper, the following aspects have been systematically investigated in details, including the pretreatment of glass slide, photoresist coating, various stages of baking parameters, exposure and developer volume, etching environment and the glass buffered oxide etch’s ratio, systematically, and then the solution to the adhesion problem of the photoresist with the glass, photoresist’s tolerance time in buffered oxide etch. After the optimization,, the etching depth can reach 80 μm, the minimum feature size could be less than 50 μm, the sidewall steepness is less than 100°, the flatness error is less than ± 1.5 μm, and the production cycle takes just 4 h.
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